Skip to main content



FineSAT Ⅴ offers high-precision, high-speed inspection of semiconductors and electronic components using ultrasonic waves (up to 25% faster measuring time *2).

(equipped with the option in the photograph)

The “FineSAT series” is offered as non-destructive equipment for detecting and imaging microscopic structures or defects inside semiconductors and electronic components by use of the reflection and transmission properties of ultrasonic waves.
In response to increasingly sophisticated needs in recent years, we developed “FineSAT Ⅴ” by enhancing the functions of the conventional equipment “FineSAT Ⅲ” and enabling measurement and inspection at improved precision and speed.
“FineSAT Ⅴ,” equipped with independently-developed data processing software and a newly-adopted 64-bit processing system, combined with a high-speed, high-precision scanner, shortens inspection/analysis time.


Use of a 64-bit processing system with improved analytical functions

Ultrasonically measured data of up to 400 million points in standard specification and up to 2 billion points in optional specification *1 can now be stored and processed. With FineSAT Ⅲ, the minimum measuring pitch was 40 µm when imaging an 200mm (8-inch) wafer in single measurement. In contrast, FineSAT Ⅴ can obtain and image data in 20 µm pitch in standard specification and in 10 µm or smaller pitch in optional specification, enabling detailed measurement of a large sample in a single scan. It also enables various image displays that support high-precision analysis/evaluation.

The maximum scanning speed is improved to 2,000 mm/s, shortening the inspection time


When measuring a large sample such as a wafer, the measurement time is largely affected by the scanning speed. The measurement time of FineSAT Ⅲ is shortened by 25% *2 by reducing the ultrasonic pulse generation cycle by half in addition to using a high-speed scanner. The maximum scanning speed of the scanner excluding acceleration and deceleration time has improved to 2,000 mm/s. *3 The newly designed highly-rigid frame suppresses equipment vibration, producing crisp images even from high-speed scanning.

Outfitted in consideration of installation location and ease of operation


  1. In consideration of its use in a clean room, it is equipped with a flap-type scanner door. An antistatic-type transparent panel is also available as a door option for better dust proofing.
  2. The lower front window can be fully opened by rotating it 180° downward, so that the stage frame can be easily removed and attached when setting a sample or performing maintenance work.
  3. The main unit's control section adopts an antistatic panel to suppress the effect of static electricity on the operator.
  4. The lifter can be moved up and down by simply turning the power of the main unit on. It moves without activating the FineSAT software.
  5. The standard equipment is fitted with a local switch box. The conventional method of moving the probe inside the scanner was to operate the buttons on the monitor screen with the mouse or operate the keyboard, while shifting the eyes alternately between the probe and the monitor or the keyboard. Use of the local switch box allows minor adjustment of the probe positions without taking your eyes off.
  6. The monitor screen size is now 23 inches, significantly improving visibility in data analysis and ease of operation. A dual monitor option is available.
When optional GUIPC is used.
It shows relative ratio against our conventional equipment and varies depending on conditions.
The maximum scanning speed may be restricted depending on measuring conditions.


A 64-bit processing system is used to sharply enhance the analytical functions.

High-resolution waveform display


The unit of ultrasonic measuring time can be set to one quarter that of the conventional unit, increasing the depth-direction resolution by 4 times. This improves the detection of delamination or defects inside the thin layers of increasingly fine-processed, multi-layered electronic devices. It also improves the accuracy of depth position information.



This function is for scanning whilst continuously changing focus points. It enables you to capture images focused at multiple varying depths in a single measurement, thus preventing defects from being overlooked.

Multi-gate thumbnail display


Images obtained from multi-gate measurement, which involve various information, can be displayed in thumbnail view for easy selection.
The color palette of a thumbnail image can be changed individually.

Overlay display (overlay of a reflection image and a transmission image)

Two images captured simultaneously by reflection and transmission methods of measurement can be overlaid in display. In addition, the transmission ratio of a displayed image is adjustable, allowing you to choose a setting that provides ease of judgment.

Optional software such as image sharpening, volume image, and void viewer is available

The advanced analytical software that can be used in combination includes: image sharpening software to sharpen images by supplementing the degradation of ultrasonic signals; volume image software to analyze recorded waveform data into measured images and waveforms after measurement; and void viewer software to display voids (defects) and make acceptance/rejection judgment and perform statistical processing.

Surface tracking scan function

Surface tracking scan function
(mp4 format, 2.48 MBytes)

It is a scanning method that can be applied to warped wafers or swelled subjects. It is possible to scan to track the surface of the subject.


Probe frequency (MHz) 5–200 5–400
Effective stroke (X × Y × Z) (mm) 350 × 350 × 80
Maximum scanning speed (mm/s) 2,000 [Nominal value]
Maximum measurement counts (points) Standard: 400,000,000
GUIPC option: 2,000,000,000
External dimensions (W × H × D) (mm) 1,590 × 1,300 × 940 (with the door closed)
Mass (kg) Approx. 470
Power supply (voltage/current/frequency) AC100V/15A/ 50/60 Hz
For special specifications, please contact us.
  • An English version of the software is also available.

Dimensional diagram (standard specification)

(Unit: mm)