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Copper Plating Solution for TSV use

Copper Plating Solution (ESA-21)

Copper Plating Solution (ESA-21)

It is the copper plating solution which is optimized for our vertical plating tank

Use

TSV (penetration electrode) implantation, conformal plating, pattern plating

Features

  • It has superior filling performance for implantation plating.
  • It has superior uniformity of the film thickness.

Copper Plating Solution (EWF-S)

It is the copper plating solution which is optimized to our high-speed flow plating tank.
It can shorten of the plating time with high-speed flow plating machine.

Use

TSV (penetration electrode) implantation, conformal plating, high-speed post-plating

Features

  • It has superior filling performance for implantation plating.
  • It has superior uniformity of the film thickness.