Plating Machine (including TSV use) : Hitachi Power Solutions Co.,Ltd. : Hitachi

Plating Machine (HIKEP series)

It aims at the standard of the vertical plating machine which adapts various plating, such as the bump onto a semiconductor wafer, the pattern plating as the rewiring, and the implantation plating.

Features

It enables high performance of the film thickness distribution on a bump plating and the pattern plating
About TSV, it can do high-speed implantation and plating with few flaw
About the alloy plating, it can uniform the composition distribution on the entire wafer surface
It can be designed as your needs

Use


Plating kind	Copper, nickel, gold, solder, lead-free solder (SnAg), magnetic film, and so on.
Wafer size	Φ 3 to 12 inches (please consult us if substrate has special shape).
Wafer materials	Si/ glass /GaAs, InP, and so on (It is OK if the substrate is made of special material).
Plating shape	Stereotypical film, pattern, padding, conformal, and so on (please consult us if special shape).

Experimental Plating Machine (HIKEP-M／J)

Experimental machine for small quantity or prototype

Small and compact.
You can do plating of each size by preparing plating jigs of various size.
We have the experimental machine of desktop type.
Please contact us for more information.

Manual Plating Machine (HIKEP-MM)

It is a manual machine for small or medium production

You can do plating of the different wafer size by preparing plating jigs of various size.
It is equipped with management software which manages the process condition including the plating recipe.

Automatic Stage Manual Operation Plating Machine (HIKEP-AM)

Manual plating machine with full-automatic plating unit for small and trial production

It is the plating unit for full-automatic machine.
It automatize plating / cleaning / drying by installed spinner. (but, only wafer transportation is manually.)
It adapts with various wafer sizes. (3 to 12 inches)
It is equipped with management software which manages the processing condition including the plating recipe.

Semi-automatic Plating Machine (HIKEP-HA)

It is a jig conveyance automatic machine for medium and mass production

It conveys a plating jig automatically, and do plating / washing / drying as automatic conveyance process.
It can process wafers of various sizes at the same time by exchanging plating jigs.
It is equipped with management software which manages the processing condition including the plating recipe.

Full-automatic Plating Machine (HIKEP-S)

Full-automatic plating machine for mass production

It can do complete Dry in / Dry out by the Casette-to-Casette mode.
It realizes full-automation with the vertical plating tank which is feature of our products.
It realizes high throughput and compact.
It is adaptable for open cassette, FOUP, AGV.
It is adaptable for ONLINE such as GEM(300).

High-speed Flow Plating Machine (HIKEP-Tornade)

Plating machine for the high-speed plating

It shortens time for implantation plating such as TSV (penetration electrode) by improving the ion diffusibility by the high-speed flow.
It shortens the time for high film thickness plating such as post-plating, too.
It can produce by manual machine and full-automatic machine.
Please contact us for more details.

Other plating machine for special substrates

You can consult us about not only the wafer but also the glass substrate of the special shape and the special material substrate.
If there are requests, please feel free to contact us.