| Plating kind | Copper, nickel, gold, solder |
|---|---|
| Lead-free solder (SnAg), magnetic film, and so on | |
| Others, metal plating (negotiable) | |
| Wafer size | Φ 3 to 12 inches (please consult us if substrate has special shape) |
| Wafer materials | Si/ glass /GaAs, InP, and so on (It is OK if the substrate is made of special material) |
| Plating shape | Stereotypical film, pattern, padding, conformal, and so on (please consult us if special shape) |
